ULTRASONIC BONDING OF ELECTRICAL DEVICES

摘要

A method for bonding an electronic device (1) to a substrate (6) without raising the ambient temperature of the environment is provided by forming a raised metallization layer (5) on a bond pad (4) of the electronic device (1), placing the bond pad (4) of the electronic device opposite a contact pad metallization (7) of the substrate (6) creating an interface between the electronic device (1) and the substrate (6), applying a compressive force normal to the interface between the electronic device (1) and the substrate (6), and applying ultrasonic energy to the electronic device whereby a diffusion joint is formed between the bond pad (4) of the electronic device (1) and the contact pad metallization (7) of the substrate.