Carrier for holding and individual electrical contacting of individual semiconductor dies during testing or burning in has contact assemblies with an elastomer bump that enables contacting of dies using a vacuum force

摘要

Carrier for holding and individual electrical contacting of individual dies (naked chips) for testing or burning-in. The carrier has first contacts that are arranged in a pattern matching the die to be contacted. The first contacts are provided with elastomer bumps (6) which have second contacts on their tips. The dies are drawn against the elastomer bumps by a force generated by a vacuum.