CHEMICAL/MECHANICAL POLISHING PAD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad capable of polishing without conditioning by using a diamond conditioner, or without intentionally deteriorating the planarity of a polishing face.

SOLUTION: This polishing pad is made mainly of graphite. Thus, it is possible to polish a CMP target layer without conditioning by using a diamond conditioner, or without intentionally deteriorating the planarity of the face to be polished.

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