发明名称 PHOTOPOLYMERIZABLE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photopolymerizable resin composition excellent in resolution of a resist pattern after development while having high sensitivity, excellent also in tenting property of a hardened film and flocculating property during dispersion in a developing solution, and useful as an alkali developable DFR for manufacture of a printed wiring board. <P>SOLUTION: The photopolymerizable resin composition is prepared which contains (a) 20-80 mass% of a binder resin comprising a linear polymer having a carboxyl content of 100-600 (expressed in terms of acid equivalent) and a weight average molecular weight of 20,000-500,000, (b) 5-70 mass% of a photopolymerizable unsaturated compound containing the di(meth)acrylate of an alkylene oxide adduct of bisphenol A, and (c) 0.1-15 mass% of a photopolymerization initiator containing a thioxanthone compound, a dialkylaminobenzoic acid compound and a lophine compound. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004212805(A) 申请公布日期 2004.07.29
申请号 JP20030001425 申请日期 2003.01.07
申请人 ASAHI KASEI ELECTRONICS CO LTD 发明人 TAKAHASHI JUNICHI;IGARASHI TSUTOMU
分类号 G03F7/027;C08F2/50;C08F265/00;C08F299/02;G03F7/004;G03F7/028;G03F7/033 主分类号 G03F7/027
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