| 摘要 |
PROBLEM TO BE SOLVED: To provide a high molecular weight polyamide resin composition suitable as industrial materials such as various mechanical indusrial parts and electric/electronic parts, which has the superior moldability in that stability of the melt viscosity at the time of molding is excellent and fouling of the mold caused by thermal decomposition components is reduced and which gives a molded product excellent in sliding property, abrasion resistance and appearance. SOLUTION: The polyamide resin composition comprises, based on 100 pts.wt. of a high molecular weight polyamide 66 (A) having a relative viscosity (RV) of 80-350, 0.005-0.1 pt.wt. of an organic thermal stabilizer (B) chosen from hindered phenols, 0.005-0.1 pt.wt. of a higher fatty acid ester (C) having an acid number of 5-50 (mgKOH/g) and a saponification number of 50-200 (mgKOH/g), and 0.01-0.1 pt.wt. of a metal salt of a higher fatty acid (D). COPYRIGHT: (C)2004,JPO&NCIPI
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