| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator the size and cost of which can be reduced. <P>SOLUTION: A circuit pattern 12 of an integrated circuit element 10 is formed to a lower side of a flat plate 11 made of an electric insulating material and a cavity 20 to mount a piezoelectric vibrating chip 5 therein is formed to an upper side of the flat plate 11. Further, a through-hole 24 led from an inner bottom face of the cavity 20 to the circuit pattern 12 is formed, a mount electrode 26 is formed around an opening of the through-hole 24 at the side of the cavity 20 and a conductive film is formed to an inner circumferential face of the through-hole 24 to ensure conduction between the mount electrode 26 and the circuit pattern 12. Then the piezoelectric vibrating chip 5 is mounted to the mount electrode 26. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
