| 发明名称 |
High conductivity inks with improved adhesion |
| 摘要 |
Conductive ink compositions which can be cured to highly conductive metal traces by means of "chemical welding" include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.
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| 申请公布号 |
US2004144958(A1) |
申请公布日期 |
2004.07.29 |
| 申请号 |
US20030353837 |
申请日期 |
2003.01.29 |
| 申请人 |
CONAGHAN BRIAN F.;JABLONSKI GREGORY A.;KYDD PAUL H.;MENDOZA ISABEL;RICHARD DAVID L. |
发明人 |
CONAGHAN BRIAN F.;JABLONSKI GREGORY A.;KYDD PAUL H.;MENDOZA ISABEL;RICHARD DAVID L. |
| 分类号 |
C09D11/00;H01B1/22;H05K1/09;(IPC1-7):B05D3/02 |
主分类号 |
C09D11/00 |
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