| 发明名称 |
ELECTRONIC DEVICE AND ITS MANUFACTURING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To form the electronic device of a chip size excellent in sealing property with the reduced number of processes . <P>SOLUTION: In electronic parts consisted of a chip including a side for functioning and an electrode at least on one side and a substrate having its portion of the chip which is connectable with the electrode of the chip, electrical connection between the chip and the substrate is provided by making use of a conductive glass and an intermetallic compound for the connection part, and simultaneously a device side on the chip is sealed. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
| 申请公布号 |
JP2004214469(A) |
申请公布日期 |
2004.07.29 |
| 申请号 |
JP20030000789 |
申请日期 |
2003.01.07 |
| 申请人 |
HITACHI LTD;HITACHI MEDIA ELECTORONICS CO LTD |
发明人 |
FUJIWARA SHINICHI;HARADA MASAHIDE;MATSUMOTO KUNIO;MATSUZAKI EIJI |
| 分类号 |
H01L21/60;H01L23/02;H03H3/007;H03H3/08;H03H9/10;H03H9/25 |
主分类号 |
H01L21/60 |
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