发明名称 LASER DIODE MODULE FOR OPTICAL COMMUNICATIONS
摘要 PROBLEM TO BE SOLVED: To provide a laser diode module for optical communications which is equipped with a micro thermoelectric cooling element capable of manufacturing in a low cost module and mounting on a small OSA. SOLUTION: The laser diode module for optical communications is composed of a housing 30 having a side wall, a heat sink 32 located on an upper surface of the housing, a superlattice micro cooler 40 placed on an upper surface of the heat sink, a laser diode 35 which is positioned on an upper surface of the superlattice micro cooler and emits a laser beam, a photodiode 37 which converts light emitted from the laser diode to an electric current, and a light collecting element 38 which is located on the upper surface of the heat sink and collects the laser beam emitted from the laser diode. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004214671(A) 申请公布日期 2004.07.29
申请号 JP20030432332 申请日期 2003.12.26
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 LEE SANG-HO
分类号 B81B1/00;G02B6/42;H01L23/38;H01L31/167;H01S3/04;H01S3/091;H01S5/00;H01S5/02;H01S5/022;H01S5/024;(IPC1-7):H01S5/024 主分类号 B81B1/00
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