Correcting method for translatoric axial deflection of semiconductor rod relative to cutting plane during sawing of semiconductor rod, e.g. of ruby or gallium-gadolinium garnet, using sensors for determining deflection

摘要

Correction uses sensors for determining deflection. Instead of measuring value for deflection, a value for axial deflection, computed from machine data and process magnitudes, is used. Typically sawing of rod is carried out by saw with inner aperture. Deflection of semiconductor rod may be carried out by piezoelectric element. Typically linear variable differential transformer sensors are used.