METHOD FOR PLANARIZATION ETCH WITH i IN-SITU /i MONITORING BY INTERFEROMETRY PRIOR TO RECESS ETCH,申请号EP20020776412-传众专利搜索

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发明名称	METHOD FOR PLANARIZATION ETCH WITH i IN-SITU /i MONITORING BY INTERFEROMETRY PRIOR TO RECESS ETCH
摘要
申请公布号	EP1440466(A2)	申请公布日期	2004.07.28
申请号	EP20020776412	申请日期	2002.10.30
申请人	LAM RESEARCH CORPORATION	发明人	BRALY, LINDA;VAHEDI, VAHID;EDELBERG, ERIK;MILLER, ALAN
分类号	H01L27/04;H01L21/321;H01L21/3213;H01L21/763;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/66	主分类号	H01L27/04
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