发明名称 |
ALLOY FOR SOLDER AND SOLDER JOINT |
摘要 |
A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb-Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys. |
申请公布号 |
EP1332831(A4) |
申请公布日期 |
2004.07.28 |
申请号 |
EP20010972512 |
申请日期 |
2001.09.26 |
申请人 |
FUJITSU LIMITED |
发明人 |
KITAJIMA, MASAYUKI;SHONO, TADAAKI;HONMA, HITOSHI;TAKESUE, MASAKAZU;NODA, YUTAKA |
分类号 |
B23K35/24;B23K35/26;C22C13/00;C22C13/02 |
主分类号 |
B23K35/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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