APPARATUS FOR REMOVING PARTICLES FROM BACK SURFACE OF WAFER WITH ELECTROSTATIC PLATE

摘要

PURPOSE: A particle removal apparatus is provided to absorb particles from a back surface of a wafer and prevent contamination of a wafer chuck by installing an electrostatic plate on a wafer transferring path. CONSTITUTION: An electrostatic plate(10) is used for generating static electricity according to a supply voltage. A plurality of photo sensors(12a,12b) are arranged at both sides of the electrostatic plate in order to sense the presence of wafers. A power supply is used for providing the supply voltage to generate the static electricity. A controller is used for controlling the supply voltage applied to the electrostatic plate according to input signals of the photo sensors. A manual switch is used for preventing the supply voltage applied to the electrostatic plate while the electrostatic plate is cleaned.