| 摘要 |
A printed wiring board 50 is assembled to a molded ink manifold 52. A bonding board 50 has circuit contacts 54 aligned on a similar pitch as circuit contacts 56 on a die module 58. A fluid seal material 64 is applied onto the die mold 58 on an ink inlet surface. During the same dispensing step, a series of microdots of conventional isotropic conductive adhesive 62 are dispensed upon the circuit contacts 56 of the die module 58. The die module 58 is aligned brought into contact with the manifold 52/wiring board 50 assembly. The bonds made by the fluid sealant 64 and the isotropic conductive adhesive 62 are cured simultaneously in an oven.
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