发明名称 |
Semiconductor wafer and testing method for the same |
摘要 |
A semiconductor wafer includes a plurality of areas and an array of dice disposed within each of the areas. The feature of the present invention is that at least two fiducial marks are disposed in each of the areas. The present invention further provides a method of testing a sawed semiconductor wafer.
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申请公布号 |
US6768332(B2) |
申请公布日期 |
2004.07.27 |
申请号 |
US20030385565 |
申请日期 |
2003.03.12 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING INC. |
发明人 |
LIN YUEH LUNG;TONG HO MING;FENG YAO HSIN;TAO SU;PAN CHI CHENG;YANG KUO PIN;HUNG SUNG CHING |
分类号 |
G01R31/28;(IPC1-7):G10R31/26 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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