发明名称 Semiconductor wafer and testing method for the same
摘要 A semiconductor wafer includes a plurality of areas and an array of dice disposed within each of the areas. The feature of the present invention is that at least two fiducial marks are disposed in each of the areas. The present invention further provides a method of testing a sawed semiconductor wafer.
申请公布号 US6768332(B2) 申请公布日期 2004.07.27
申请号 US20030385565 申请日期 2003.03.12
申请人 ADVANCED SEMICONDUCTOR ENGINEERING INC. 发明人 LIN YUEH LUNG;TONG HO MING;FENG YAO HSIN;TAO SU;PAN CHI CHENG;YANG KUO PIN;HUNG SUNG CHING
分类号 G01R31/28;(IPC1-7):G10R31/26 主分类号 G01R31/28
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