| 摘要 |
PURPOSE: Provided are a curable resin composition capable of giving a cured product having excellent heat resistance and having low dielectric constant and low dielectric loss tangent and its cured product. CONSTITUTION: The curable resin composition contains a polyfunctional cyanate ester resin and a bifunctional phenylene ether oligomer having a number average molecular weight of 500 to 3,000 and having a specific structure represented by the formula (1), H-£O-Y|a(O-X-O)£Y-O|b-H, wherein -(O-X-O)- is represented by the formula (2), in which R1, R2, R7 and R8 may be the same or different and are a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, R3, R4, R5 and R6 may be the same or different and are a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and A is a linear, branched or cyclic hydrocarbon having 20 or less carbon atoms or a direct bond, -(Y-O)- is an arrangement of one kind of structure defined by the formula (3) or a random arrangement of at least two kinds of structures defined by the formula (3), in which R9 and R10 may be the same or different and are a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group and R11 and R12 may be the same or different and are a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and each of a and b is an integer of 0 to 30, provided that at least either a or b is not 0.
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