| 摘要 |
Illumination light of an illumination device irradiates a part of a peripheral surface of a semiconductor wafer from a side of the semiconductor wafer. Then, a shape of a side surface of a rim of the wafer that is an area to be processed is picked up by a image-pickup device disposed in an irradiation direction so as to be opposed to the illumination device interposing the wafer. A difference of the shape of a contour of the wafer rim can be recognized visually/automatically, promptly and accurately, and a minute and local planar area to be processed on the wafer rim can be determined accurately.
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