| 发明名称 |
Transfer molding method for manufacturing semiconductor devices |
| 摘要 |
A method of transfer molding, wherein a top-half mold and a bottom-half mold of an apparatus form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any one of a plurality of cavities. |
| 申请公布号 |
US6767484(B2) |
申请公布日期 |
2004.07.27 |
| 申请号 |
US20010893455 |
申请日期 |
2001.06.29 |
| 申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
NISHI HIROYUKI;SUGAI AKIRA |
| 分类号 |
B29C45/26;B29C45/02;B29C45/34;B29C45/53;B29C45/76;B29L31/34;H01L21/56;(IPC1-7):B29C45/02;B29C45/14;B29C45/77 |
主分类号 |
B29C45/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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