发明名称 |
Defect inspecting device for substrate to be processed and method of manufacturing semiconductor device |
摘要 |
A defect inspecting device for a wafer is built in a positioning device for positioning a wafer 1, as a substrate to be processed, in a semiconductor manufacturing process. Light is irradiated on the wafer held on a vacuum holding base 2 while rotating the wafer at least one rotation from a position where the wafer is positioned and the scattered light is received. An operation unit 14 and a control unit 15 judge that if the intensity of the scattered light exceeds a predetermined threshold, a defect is detected on the wafer 1.
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申请公布号 |
US6768542(B2) |
申请公布日期 |
2004.07.27 |
申请号 |
US20020219292 |
申请日期 |
2002.08.16 |
申请人 |
RENESAS TECHNOLOGY CORP.;MITSUBISHI ELECTRIC ENGINEERING COMPANY LIMITED |
发明人 |
ISE HIROTOSHI;OONO TOSHIKI;KIMURA YASUHIRO;KOMEMURA TOSHIO;TOYOTA MASATO;NOGUCHI TOSHIHIKO |
分类号 |
G01B11/26;G01B11/30;G01N21/95;G01N21/956;H01L21/66;(IPC1-7):G01N21/00 |
主分类号 |
G01B11/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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