发明名称 Method for the manufacture of printed circuit boards with integral plated resistors
摘要 The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.
申请公布号 US6767445(B2) 申请公布日期 2004.07.27
申请号 US20020271817 申请日期 2002.10.16
申请人 KUKANSKIS PETER;DURSO FRANK;SAWOSKA DAVID 发明人 KUKANSKIS PETER;DURSO FRANK;SAWOSKA DAVID
分类号 C23C18/16;C23C18/32;C23C18/42;H01C17/06;H05K1/16;H05K3/18;H05K3/24;H05K3/28;(IPC1-7):H05K1/00 主分类号 C23C18/16
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