发明名称 |
Method for the manufacture of printed circuit boards with integral plated resistors |
摘要 |
The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.
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申请公布号 |
US6767445(B2) |
申请公布日期 |
2004.07.27 |
申请号 |
US20020271817 |
申请日期 |
2002.10.16 |
申请人 |
KUKANSKIS PETER;DURSO FRANK;SAWOSKA DAVID |
发明人 |
KUKANSKIS PETER;DURSO FRANK;SAWOSKA DAVID |
分类号 |
C23C18/16;C23C18/32;C23C18/42;H01C17/06;H05K1/16;H05K3/18;H05K3/24;H05K3/28;(IPC1-7):H05K1/00 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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