| 摘要 |
FIELD: radio-electronic engineering; electronic device cases including sealed ones. ^ SUBSTANCE: case base and cover are made of thermoplastic polymeric material. Base-to-cover joint is made in the form of V-shaped projection and groove. Encapsulated joint is obtained by ultrasonic welding over its entire perimeter in pulsed mode at static pressure; ultrasonic waves are converted into mechanical vibrations and joint is exposed to same pressure during its cooling-down period of not shorter than ultrasonic pulse duration. Electric board maintains its serviceability upon such encapsulation of its case. ^ EFFECT: enhanced strength, reliability , and productivity; reduced labor consumption. ^ 3 cl, 6 dwg |
