APPARATUS AND METHOD FOR ALIGNING AND ATTACHING SOLDER COLUMN TO SUBSTRATE CAPABLE OF EASILY ARRANGING IN UPRIGHT POSITION ON CONDUCTIVE PAD

摘要

PURPOSE: An apparatus and a method for aligning and attaching a solder column to a substrate are provided to arrange easily and simultaneously a solder column in an upright position on a corresponding conductive pad on the substrate. CONSTITUTION: An apparatus aligns and attaches a plurality of solder columns to a patterned array of corresponding electrical contact portion on a substrate(22). A substantially flat alignment plate(12) has a plurality of through holes(14) formed in a pattern identical to the pattern of the electrical contact portion and adapted to allow the solder column to vertically pass therethrough. At least one retainer(18) is clung to the alignment plate, and adapted to hold the alignment plate in a fixed position on the substrate such that the through hole is vertically aligned with the corresponding electrical contact portion. The substrate has a peripheral edge, and the at least one retainer includes a step(20) sized and configured to engage the peripheral edge of the substrate.