MICRO STRUCTURE ELEMENT AND MANUFACTURING METHOD THEREOF FOR FORMING THICK SILICON MICRO STRUCTURE

摘要

PURPOSE: A micro structure element and a manufacturing method thereof are provided to make a thick silicon micro structure without bending or damage caused by the residual stress of deposited silicon and to prevent the structure and a silicon substrate from sticking to each other. CONSTITUTION: A silicon substrate(100) is doped with a predetermined electroconductive material to have electroconductivity and formed with a micro structure of the predetermined thickness recessed from the center to both sides. A first glass substrate(200) has a first surface on which first and second electrodes(301,302) separated from each other are formed. The first electrode is directly contacted with the silicon substrate. The second electrode faces the recessed micro structure of the silicon substrate. External contact electrodes(303,304) are disposed to connect the electrodes to the outside on a second surface opposite to the first surface. A second glass substrate(300) is adhered on the opposite side of an adhering surface of the first glass substrate of the silicon substrate to seal the micro structure.