PRINTED CIRCUIT BOARD USING ALL LAYER INTERSTITIAL VIA HOLE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce manufacturing procedures and time, while achieving improved degree of freedom of substrate design. CONSTITUTION: A printed circuit board comprises a copper clad laminate on which a copper foil(212) is deposited; a B-stage epoxy resin(213) deposited on the side opposite from the copper foil of the copper clad laminate; and a conductive paste(219) filling the via hole formed at the resin. A method for manufacturing a printed circuit board comprises a step of providing a copper clad laminate; a step of coating a B-stage epoxy resin on the side opposite from the copper foil of the copper clad laminate; a step of depositing a cover film on the resin; a step of forming a via hole on the surface coated with the resin; a step of filling the via hole with a conductive paste; a step of forming a photoresist pattern on the substrate filled with the conductive paste; a step of forming a circuit pattern by etching the conductive layer by using the photoresist pattern as an etching mask; a step of removing the cover film; and a step of depositing layers.