发明名称 |
ROBOT BLADE |
摘要 |
PURPOSE: A robot blade is provided to prevent particles from a lateral part of a wafer contact part in a process for loading and unloading a wafer by using a gradient side and a round wafer contact part. CONSTITUTION: A robot blade includes a wafer storage unit and a plurality of wafer contact parts. The wafer contact parts(5) are located on the wafer storage unit(3). The wafer contact parts are located on the same straight line. The wafer contact parts are projected from the wafer storage unit. Each width of the wafer contact parts is larger than each height of the wafer contact parts. The wafer contact parts have gradient sides and round sides.
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申请公布号 |
KR20040065813(A) |
申请公布日期 |
2004.07.23 |
申请号 |
KR20030002996 |
申请日期 |
2003.01.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HUH, NAM GYUN |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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