发明名称 MANUFACTURING METHOD OF CONDUCTIVE MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a conductive molding material excellent in conductivity. SOLUTION: In this manufacturing method of a conductive molding material, a liquid resin or an organic solvent solution of the resin is dispersed/agitated in/with a dispersion liquid prepared by dispersing conductive particles each having a hydrophobic surface in water, and an aggregated substance is provided by aggregating the conductive particles by the resin. It is preferable that the resin contains a thermosetting resin, and is substantially hydrophobic. The manufacturing method has a process for substantially removing water, or water and the organic solvent from the aggregated substance. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004207016(A) 申请公布日期 2004.07.22
申请号 JP20020374267 申请日期 2002.12.25
申请人 SUMITOMO BAKELITE CO LTD 发明人 FUJII SHUNSUKE;HIRATA KOUJI
分类号 H01B1/24;H01B13/00;(IPC1-7):H01B13/00 主分类号 H01B1/24
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