发明名称 METHOD OF FORMING PROTRUDING METAL PORTIONS BY DIFFERENTIAL PLANARIZATION
摘要 <p>A metal layer is separated by intermetal gaps differing in width into a plurality of metal portions (102-105, 110, 111) after a normal damascene process. A further chemical-mechanical polishing step causes the metal portions to protrude from substrate (100), the portions (102-105) separated by wide intermetal gaps projecting higher than the portions (110, 111) showing narrow intermetal gaps.</p>
申请公布号 WO2004061950(A1) 申请公布日期 2004.07.22
申请号 WO2003US39192 申请日期 2003.12.08
申请人 INTEL CORPORATION (A DELAWARE COPRPORATION) 发明人 BOARDMAN, JAMES;KIM, SARAH;FISCHER, PAUL;KOBRINSKY, MAURO
分类号 H01L21/768;(IPC1-7):H01L21/768 主分类号 H01L21/768
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