发明名称 POLISHING PAD AND POLISHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing pad wherein its exchanging timing can be confirmed easily, and also to provide a polishing device equipped with the pad. <P>SOLUTION: A surface state detecting section 30 is provided on the polishing pad 1 so that a worker may visually confirm the depths of grooves 31 formed in the surface layer of the pad 1. The detecting section 30 is composed of a recessed section 30a and a projection 30b, and the width W1 of the recessed section 30a is made greater than those W2 of the grooves 31. In addition, the initial depth D1 of the recessed section 30a is made shallower than those D2 of the grooves 31 by the serviceable depths D3 of the grooves 31. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004207397(A) 申请公布日期 2004.07.22
申请号 JP20020373048 申请日期 2002.12.24
申请人 RODEL NITTA CO 发明人 BOKU SAIKO
分类号 B24B37/20;B24B37/24;B24B37/26;H01L21/304 主分类号 B24B37/20
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