发明名称 CONDUCTIVE LAYER TRANSFER SHEET FOR PRINTED WIRING EXCELLENT IN HEAT-RESISTANT SHRINKAGE CHARACTERISTICS
摘要 PROBLEM TO BE SOLVED: To provide a conductive layer transfer sheet and its production wherein rolling-up processability is superior, and heat shrinkage at the time of heating transfer under high temperature condition is reduced. SOLUTION: In the conductive layer transfer sheet for printed wiring constituted by forming a conductive layer on a substrate sheet front surface, a substrate sheet is used wherein a metal foil is laminated previously on the rear face of a resin layer. The sheet is manufactured by forming a release layer on a resin film layer front surface of the substrate sheet after the substrate sheet is formed by laminating previously the rear face of the resin film and the metal foil via an adhesive agent layer for lamination, and further a conductive layer is formed on the surface of the release layer. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004207425(A) 申请公布日期 2004.07.22
申请号 JP20020373641 申请日期 2002.12.25
申请人 PANAC CO LTD 发明人 KOBORI YUJI;HATTORI KATSUHIKO;TADA KAZUNORI;HASHIMOTO SHINICHI;NAKAHARA MINORU;IWATA MASATO
分类号 B44C1/17;H05K3/20;(IPC1-7):H05K3/20 主分类号 B44C1/17
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