| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip scale marker capable of giving laser marking quickly and precisely by removing a warp of a wafer. SOLUTION: The chip scale marker includes wafer chucking vacuum plate (130) at the center of a wafer holder (120) and a wafer rotating means on the surroundings of the vacuum plate (130), where a part of a region facing a laser system (100) is disclosed and a warp removal means (170) to remove the warp from the wafer is provided on such area that the wafer holder (120) is not opened. Thereby, marking quality can be improved by extending the wafer having the warp before wafer marking to individually position wafer chips at a fixed marking distance from the laser system (100) and then give the marking. COPYRIGHT: (C)2004,JPO&NCIPI
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