| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board, a semiconductor device and their manufacturing methods in which stabilized connection is ensured between the electrode of an electronic component and wiring by preventing deformation of the electrode, and to provide a circuit board and an electronic apparatus. SOLUTION: The method for manufacturing a wiring board comprises a step for partially making thin a conductive foil 20 formed on a base substrate 10 by etching, a step for patterning the conductive foil 20 by etching, and a step for forming a wiring 30 having a thin part 32 on the base substrate 10 in an area being bonded to the electrode of an electronic component. COPYRIGHT: (C)2004,JPO&NCIPI
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