发明名称 CONNECTION STRUCTURE OF FLOORING
摘要 PROBLEM TO BE SOLVED: To provide the connection structure of a flooring suppressing a step of the flooring caused by the unevenness of a floor backing material and a step caused by the expansion/contraction of the flooring, allowing the thickness of the flooring to be thin, and having high strength though being increased in thickness. SOLUTION: A plurality of floorings 2 each comprising a wood powder resin compound material 1 as a base material are arranged on the floor backing material 3. A lower projecting part 4 is formed at the side face lower half part of one flooring 2a out of the adjacent floorings 2, and an upper projecting part 5 is formed at the side face upper half part of the other flooring 2b to form the upper and lower projecting parts 4, 5 of shiplap shapes at side faces of the adjacent flooring 2. The lower projecting part 4 of one flooring 2a is fitted into a lower step 6 formed at the lower part of the upper projecting part 5 of the other flooring 2b, and the upper projecting part 5 of the other flooring 2b is fitted into an upper step 7 formed at the upper part of the lower projecting part 4 of one flooring 2a. An adhesive tape 8 is stuck across lower faces of the adjacent floorings 2. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004204504(A) 申请公布日期 2004.07.22
申请号 JP20020373198 申请日期 2002.12.24
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KONISHI SATORU;USUI HIROAKI;NOMA NORIO;WATANABE TSUTOMU;MAEDA NAOHIKO
分类号 E04F15/02;(IPC1-7):E04F15/02 主分类号 E04F15/02
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