发明名称 LEAD-FREE TIN ALLOY PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To perform uniform alloy plating by suppressing abnormal precipitation, in a lead-free tin alloy plating method. SOLUTION: Plating current value control is conducted so that an ON-OFF mode is intermittently repeated in plating current. The ratio a/b between the OFF time (a) and the ON time (b), is desirably controlled to≥0.2. It is desirably controlled to about 0.3 for preventing the extension of the total plating time as for the MAX side. The period of repeating the OFF-ON is desirably controlled to 5 times/sec or lower. Further, not simple ON-OFF but ON-OFF in which reverse potential is made on the OFF time is performed. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004204308(A) 申请公布日期 2004.07.22
申请号 JP20020375604 申请日期 2002.12.25
申请人 NEC SEMICONDUCTORS KYUSHU LTD 发明人 MATSUDA MOTOAKI;IBE MASAHIRO
分类号 C25D5/18;C25D3/30;C25D3/60;C25D7/12;H01L21/48;H01L23/50;H05K3/34;(IPC1-7):C25D5/18 主分类号 C25D5/18
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