发明名称 |
LEAD-FREE TIN ALLOY PLATING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To perform uniform alloy plating by suppressing abnormal precipitation, in a lead-free tin alloy plating method. SOLUTION: Plating current value control is conducted so that an ON-OFF mode is intermittently repeated in plating current. The ratio a/b between the OFF time (a) and the ON time (b), is desirably controlled to≥0.2. It is desirably controlled to about 0.3 for preventing the extension of the total plating time as for the MAX side. The period of repeating the OFF-ON is desirably controlled to 5 times/sec or lower. Further, not simple ON-OFF but ON-OFF in which reverse potential is made on the OFF time is performed. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004204308(A) |
申请公布日期 |
2004.07.22 |
申请号 |
JP20020375604 |
申请日期 |
2002.12.25 |
申请人 |
NEC SEMICONDUCTORS KYUSHU LTD |
发明人 |
MATSUDA MOTOAKI;IBE MASAHIRO |
分类号 |
C25D5/18;C25D3/30;C25D3/60;C25D7/12;H01L21/48;H01L23/50;H05K3/34;(IPC1-7):C25D5/18 |
主分类号 |
C25D5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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