| 摘要 |
PROBLEM TO BE SOLVED: To efficiently and inexpensively provide a flexible printed circuit board in which a plating layer is formed on one side. SOLUTION: Polyimide films 1 are superimposed. The edge parts of the superimposed parts are sealed with a seal agent S or the like. After dipping into a plating bath in this state, electroless plating layers 2 and copper plating layers 3 are successively formed on both the surfaces of the superimposed polyimide resin films. Then, the seal parts are cut to obtain two flexible printed circuit boards A in which the electroless plating layer 2 and the copper plating layer 3 are formed on one side. COPYRIGHT: (C)2004,JPO&NCIPI
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