| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition of high productivity enabling repairing even electronic component devices defective in electrical connection after underfilled once, and also enabling flip chips to be mounted by precoating a thermosetting resin composition having the function of removing metal oxide film or antioxidant film present on the surface of a semiconductor element or wiring circuit board electrode in producing a semiconductor device needing metallic bond formation such as solder bump. SOLUTION: The liquid epoxy resin composition, intended for resin sealing of the gap between the circuit board and the semiconductor element of an electronic component device mounted with the semiconductor element on the circuit board in such a condition that a connecting electrode part provided on the semiconductor element and that provided on the circuit board are allowed to stand against each other, comprises (A) a liquid epoxy resin, (B) a curing agent, (C) an N,N,N',N'-tetrasubstituted fluoroaromatic diamine compound, and (D) a carboxylic acid vinyl ether adduct. COPYRIGHT: (C)2004,JPO&NCIPI
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