| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of a micromachine package strong against external electric noise and reducing the size and cost, and a manufacturing method. SOLUTION: This package structure of a micromachine has a base board 1, a device 8 for forming a movable part on the base board 1 or deformed by a signal imparted from an external part, wiring 3 and a cap 4 composed of metal or a semiconductor, and is formed by arranging the device 8 in a space 2 composed of the base board 1 and the cap 4. A base board side joining part 6 and a cap side joining part 5 in a joining part of the base board 1 and the cap 4 are formed of metal. COPYRIGHT: (C)2004,JPO&NCIPI
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