Manufacture of printed circuit board with embedded capacitors by forming ground layer copper foil on inner layer of printed circuit board, and coating polymer capacitor paste having high-dielectric constant on ground layer copper foil

摘要

A printed circuit board with embedded capacitors is manufactured by: forming a ground layer copper foil on an inner layer of the printed circuit board; coating a polymer capacitor paste (105a, 105b) having high-dielectric constant on the ground layer copper foil (104a, 104b); layering a power layer copper foil (106a, 106b); forming a dry film pattern and etching; layering an insulation layer-attached copper film; and forming and plating a blind via-hole and a through-hole. Manufacture of a printed circuit board with embedded capacitors comprises: forming a ground layer copper foil on an inner layer of a printed circuit board, followed by roughening a surface of the ground layer copper foil; coating a polymer capacitor paste having high-dielectric constant at a predetermined thickness on the ground layer copper foil, and curing the coated polymer capacitor paste; layering a power layer copper foil to the cured capacitor; forming a dry film pattern on the power layer copper foil, and etching the dry film pattern by use of an etching mask so that the power layer copper foil is partitioned; layering an insulation layer-attached copper film to the power layer copper foil; forming a blind via-hole and a through-hole at predetermined portions of the insulation layer-attached copper film; and plating the blind via-hole and the through-hole for layer connection.