摘要 |
<p>A cooling device for a heat-generating electronic component such as a semiconductor integrated circuit element, especially a cooling device using a thermoelectric conversion material. A cooling device for an electronic component comprising a thermoelectric conversion material that is either p type or n type, or a combination of p type and n type arranged alternately and in series, and two electrodes as an anode and a cathode that sandwich the thermoelectric conversion material and are electrically short-circuited, characterized in that the device is allowed to contact an electronic component requiring cooling so that one electrode side contacting the thermoelectric conversion material functions as a low-temperature side and the other electrode side functions as a high-temperature side, a current is generated by a thermo-electromotive force generated in the thermoelectric conversion material by a temperature difference between the two electrodes, and a high-temperature side is cooled by that current.</p> |
申请人 |
JAPAN SCIENCE AND TECHNOLOGY AGENCY;NITTO DENKO CORPORATION;HIRAI, SHINJI;NISHIMURA, TOSHIYUKI;UEMURA, YOICHIRO;MORITA, SHIGENORI;OHTA, MICHIHIRO;IGARASHI, KAZUMASA |
发明人 |
HIRAI, SHINJI;NISHIMURA, TOSHIYUKI;UEMURA, YOICHIRO;MORITA, SHIGENORI;OHTA, MICHIHIRO;IGARASHI, KAZUMASA |