发明名称 COOLING DEVICE FOR ELECTRONIC COMPONENT USING THERMO-ELECTRIC CONVERSION MATERIAL
摘要 <p>A cooling device for a heat-generating electronic component such as a semiconductor integrated circuit element, especially a cooling device using a thermoelectric conversion material. A cooling device for an electronic component comprising a thermoelectric conversion material that is either p type or n type, or a combination of p type and n type arranged alternately and in series, and two electrodes as an anode and a cathode that sandwich the thermoelectric conversion material and are electrically short-circuited, characterized in that the device is allowed to contact an electronic component requiring cooling so that one electrode side contacting the thermoelectric conversion material functions as a low-temperature side and the other electrode side functions as a high-temperature side, a current is generated by a thermo-electromotive force generated in the thermoelectric conversion material by a temperature difference between the two electrodes, and a high-temperature side is cooled by that current.</p>
申请公布号 WO2004061982(A1) 申请公布日期 2004.07.22
申请号 WO2003JP17080 申请日期 2003.12.26
申请人 JAPAN SCIENCE AND TECHNOLOGY AGENCY;NITTO DENKO CORPORATION;HIRAI, SHINJI;NISHIMURA, TOSHIYUKI;UEMURA, YOICHIRO;MORITA, SHIGENORI;OHTA, MICHIHIRO;IGARASHI, KAZUMASA 发明人 HIRAI, SHINJI;NISHIMURA, TOSHIYUKI;UEMURA, YOICHIRO;MORITA, SHIGENORI;OHTA, MICHIHIRO;IGARASHI, KAZUMASA
分类号 H01L35/32;H01L23/38;H01L35/16;(IPC1-7):H01L35/32 主分类号 H01L35/32
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