| 摘要 |
A method ( 400 ) for determining a response to a wafer manufacturing process problem includes the steps of generating a wafer map signature ( 406 ) containing defect attributes to be identified and retrieving ( 410 ) one or more wafer map signatures from a database. The wafer map signature to be identified is matched ( 414 ) with the one or more wafer map signatures from the database in order to help find a root cause of a defect in a wafer manufacturing process. This provides at least the advantage that a signature matching capability allows an Operator to more accurately identify a root manufacturing cause of a wafer defect. Furthermore, instant feedback to the wafer manufacturing process can be provided to facilitate rapid correction of manufacturing errors. |
