POLISHING HEAD AND CMP APPARATUS

摘要

PURPOSE: A polishing head and a CMP apparatus are provided to flatten a contact part between a membrane and a wafer and enhance the polishing uniformity by shifting simultaneously a slide ring and a membrane. CONSTITUTION: A polishing head includes a membrane supporter, a membrane, and a slide part in order to perform a CMP process for a semiconductor substrate. The membrane supporter(210) is located on a bottom side of the polishing head. The membrane(230) includes a pressing part having plural regions and a dividing part for dividing the pressing part into the plural regions. The membrane is fixed to the membrane supporter. The slide part is used for fixing the dividing part. The slide part and the pressing part are shifted within a guide groove of the membrane supporter.