发明名称 METHOD FOR CONNECTING TRANSFER SHEET, CONDUCTIVE PARTICLE TRANSFER SHEET AND CONDUCTIVE PARTICLE TO ELECTRODE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for connecting a conductive particulate transfer sheet and a conductive particulate to an electrode capable of arranging the conductive particulate on the electrode of electronic of electronic components so as not to shift and drop out and collectively, surely, and easily welding and connecting to an electrode on electronic components. <P>SOLUTION: A transfer sheet bonding a member to be transferred on a heating annihilation bonding resin layer, a conductive particulate transfer sheet bonding a conductive particulate on a sheet-like heating annihilation bonding resin and arranged, a conductive particulate transfer sheet arranged the conductive particulate on the heating annihilation bonding sheet so that the conductive particulate is arranged in the state contact or noncontact, and the electronic components are superimposed. The conductive particulate is weld to the electrode of the electronic components to connect. The conductive particulate, which the heating annihilation bonding sheet is eliminated by heating, is connected to the electrode. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004207698(A) 申请公布日期 2004.07.22
申请号 JP20030396087 申请日期 2003.11.26
申请人 SEKISUI CHEM CO LTD 发明人 ENAMI TOSHIO;FUKUI KOJI
分类号 B32B7/02;C08G65/329;C08G65/336;C08J11/06;C08K3/22;C08K5/14;C08K5/17;C08K5/23;C08K5/37;C08L71/02;C09J7/02;C09J11/00;C09J171/00;H01B5/14;H01L21/60;H01L21/68;H01L21/768;H05K1/03;H05K3/04;H05K3/20;H05K3/34 主分类号 B32B7/02
代理机构 代理人
主权项
地址