发明名称 PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING IT
摘要 PROBLEM TO BE SOLVED: To solve the problem that an electric signal having a high frequency cannot be transmitted to a wiring conductor at a high speed. SOLUTION: A semiconductor device is composed of a base body 1 on which a semiconductor element 6 transmitting and receiving the electric signal having the high frequency is loaded, the ground wiring conductors 2b and the first wiring conductors 2a formed to the base body 1, pads 3b for a ground and pads 3a for an input and an output electrically connected to the wiring conductors 2b and the wiring conductors 2a, the second wiring conductor 4 formed to the base body 1, and a connector 5 electrically connected to the wiring conductor 4. The base body 1 is formed of a sintered body in which an Si component is contained in 25 to 80 mass % in terms of SiO<SB>2</SB>, a Ba component in 15 to 70 mass % in terms of BaO, a B component in 1.5 to 5 mass % in terms of B<SB>2</SB>O<SB>3</SB>, an Al component in 1 to 30 mass % in terms of Al<SB>2</SB>O<SB>3</SB>, and a Ca component at a value from O mass % to 30 mass % in terms of CaO. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004207523(A) 申请公布日期 2004.07.22
申请号 JP20020375525 申请日期 2002.12.25
申请人 KYOCERA CORP 发明人 YONEKURA MANABU;SAWA YOSHINOBU;HIRAKAWA TETSUO
分类号 C04B35/14;H01L23/12;H01L23/15;(IPC1-7):H01L23/15 主分类号 C04B35/14
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