| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module which is excellent in strength and heat absorbing property. SOLUTION: In the thermoelectric module, a lower electrode 3 and an upper electrode 4 are formed each by plating or the like in an insulating lower substrate 1 and upper substrate 2 such as ceramics, the lower substrate 1 and the upper substrate 2 are disposed parallel so that the lower electrode 3 and the upper electrode 4 face each other, and a plurality of copper or copper alloy conductive chips 7 and a plurality of thermoelectric elements 5 joined thereto are arranged therebetween. The conductive chip 7 is joined to a lower end of the thermoelectric element 5, and a lower end of the conductive chip 7 is joined to the lower electrode 3. An upper end of the thermoelectric element 5 is joined to the upper electrode 4. A p-type thermoelectric element 5a and an n-type thermoelectric element 5b are arranged alternately in the lower electrode 3 and the upper electrode 4. Adjacent n-type thermoelectric element 5a and n-type thermoelectric element 5b are connected to one upper electrode 4a in an upper end thereof. A lead line 8 is connected to the lower electrode 3 whereto a thermoelement at both end parts is joined. COPYRIGHT: (C)2004,JPO&NCIPI
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