| 摘要 |
PROBLEM TO BE SOLVED: To easily treat a semiconductor wafer thinned by grinding and to make it possible to always recognize crystal azimuth even when a notch is caused in the outer periphery of the semiconductor wafer. SOLUTION: The semiconductor wafer is supported by the supporting surface 11 of a wafer support plate 10 on which a crystal azimuth mark 12 indicating the crystal azimuth of the semiconductor wafer is formed and the crystal azimuth can be always recognized by the crystal azimuth mark 12. COPYRIGHT: (C)2004,JPO&NCIPI |
