| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a connection substrate and a method for manufacturing a multilayer wiring board for highly precisely positioning a plurality of connection substrates and for collectively laminating them. SOLUTION: In the manufacturing method of the connection substrate, a composite metal layer formed of at least a second metal layer and a first metal layer whose removal condition differs from the second metal layer is arranged on one face or both faces of a support substrate so that a second metal layer-side becomes a support substrate-side. They are heated, pressurized and are temporarily fixed, and a prescribed process is performed. In the manufacturing method of the multilayer wiring board, guide pins are made to pass through guide holes formed in a plurality of the connection substrates so as to adjust positions. Prescribed parts are thermally fused and are positioned and fixed. The substrates are heated, pressurized and collectively laminated. COPYRIGHT: (C)2004,JPO&NCIPI |
