SEMICONDUCTOR DEVICE AND ITS PRODUCING PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device in which the reliability and productivity of a semiconductor chip packaging line are enhanced by eliminating thermal fusion of an insulating layer and a heating tool or a stage, and to provide its producing process. SOLUTION: The semiconductor device comprises a semiconductor chip 30 mounted on a flexible printed wiring board 20 having a wiring pattern 21 formed by patterning a conductor layer 11 deposited at least on one side of an insulating layer 12 and mounting the semiconductor chip and provided with a release layer 13 on the side of the insulating layer 12 opposite to the side mounting the semiconductor chip. COPYRIGHT: (C)2004,JPO&NCIPI