发明名称 LAMINATED ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide laminated electronic components having uniform characteristics and built-in coils with improved a Q value and a method for manufacturing the laminated electronic components. SOLUTION: A plurality of coil forming recessed grooves 2 are aligned and worked on a green sheet 1 and conductive paste 3 for forming coils is printed in each recessed groove 2. Then a plurality of green sheets 1 are laminated, a plurality of coils are formed in the laminated green sheets 1, the laminated green sheets 1 are cut off and sintered, and thermal electrodes are formed on both the ends of the cut sheets 1. A part of a coil conductor is partrally overlapped on both the sides of each recessed groove 2 in the cross-sectional shape after sintering the coil. The aspect ratio t/w of thickness (t) to width (w) of a cross section of the coil conductor is 0.7 and more. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004207608(A) 申请公布日期 2004.07.22
申请号 JP20020377093 申请日期 2002.12.26
申请人 TDK CORP 发明人 KUMAGAI OSAMI;SATO SHINICHI;TAKAHASHI TORU
分类号 H01F41/04;H01F17/00;(IPC1-7):H01F17/00 主分类号 H01F41/04
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