| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which can be used for an underfill agent. <P>SOLUTION: [1] The positive photosensitive composition comprises an epoxy compound having two or more epoxy groups in one molecule, a curing catalyst or a compound which produces a curing catalyst by heat, and sulfonic acid esters. [2] A semiconductor member is manufactured by applying the above positive photosensitive composition onto a substrate, exposing, curing the unexposed part by heat, and developing the exposed part. [3] A display member is manufactured by applying the above positive photosensitive composition onto a substrate, exposing, curing the unexposed part by heat and developing the exposed part. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
