| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device capable of bending the outer leads according to the design, and to provide a semiconductor device, a circuit board and electronic equipment having high reliability. <P>SOLUTION: The manufacturing method for the semiconductor device includes bending by a press working of the broad width section 70 of the outer leads 24 extended to the outside of a sealed section 50 and the further bending in the direction by the press working of the broad width section 70 by a winding working. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
