| 摘要 |
PROBLEM TO BE SOLVED: To easily manufacture many kinds of semiconductor packages. SOLUTION: An apparatus for manufacturing a semiconductor device includes a molding unit 10 having a mold 12 comprising an upper mold 14 and a lower mold 16 for sealing a semiconductor chip 40. Detachable plates 20, 30 are provided on opposed surfaces of the upper mold 14 and the lower mold 16. The plates 20 and 30 respectively have through holes 22 and 32. The recess of a cavity 54 is formed of the front surface of the upper mold 14 or the lower mold 16 and the inner surfaces of the through holes 22 and 32. COPYRIGHT: (C)2004,JPO&NCIPI |
